In late January, I reported the VIA announcement of their new Isaiah Architecture, which promised to deliver a massive increase in raw computing power while maintaining a similar power envelope to previous VIA platforms.

Well, it looks like VIA are still on track to start shipping the new chips in Q2, and more and more details about the, as yet unnamed, processor are starting to come out. Yesterday, I read a good article on CNet that commented on a few of these new details. Of particular interest was the figure of 3.5 watts that was mentioned for TDP. Given the in-order nature of Intel’s Atom processors (which look to have only a slightly lower TDP), I imagine chips based on VIA’s out-of-order, superscalar architecture are going to be very popular and certainly the industry's leading processors in terms of performance per watt when they hit the market.

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Visitor

Wednesday, 26 March 2008

Wow, 3.5W TDP only? And still doubling the number-crunching abilities of a C7? So a dual core Isaiah would roughly have the TDP of a current 1.2Ghz C7 while quadruplicating its processor power?

Visitor

Friday, 28 March 2008

What should happen now, with Intel coming in to take his share of the low-power cake, now is that VIA will have to drop the price of their products to a reasonable amount since they are not the only player in the field anymore.

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